Design-Reuse4y
Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
CES - 18th January 2021 --T2MIP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Software Link Layer, ...
Design-Reuse4y
Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles & LC3 codec licensed to leading Tier 1 Company for ultra-low power TWS Hearable Audio SoC
September 28, 2020 --T2M IP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Protocol Stack SW, ...