Mirabilis Design announced today the latest addition to the VisualSim Architect with modelling support for Arteris’ FlexNoC ...

CoMira Solutions today announced its new 1.6T Ethernet UMAC IP. This specified UMAC IP delivers 1.6Tbps bandwidth with low ...

Dolphin Semiconductor, a leading provider of semiconductor IP solutions specializing in mixed-signal IP design, is announcing ...

Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that ...

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, ...

Accellera announced today that its Board of Directors has approved the Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 standard for release. The new standard is available for ...

While design engineers contemplate the power, performance and area calculation of an SoC design, their verification ...

Ceva today announced the appointment of Amir Faintuch, a seasoned technology executive, to its Board of Directors as an ...

PIX, the leader in innovative image processing and compression technologies, is proud to announce the integration of its advanced TicoXS FIP codec into EvertzAV’s latest AV-over-IP solutions.

As the semiconductor industry pushes the boundaries of innovation, modern system-on-chip (SoC) designs are growing exponentially in size and complexity. With hundreds of IP blocks and thousands of ...

Industry leaders join team of experts including Jim Keller, Sailesh Kumar and Stan Reiss to propel innovation in the new era of high-performance system-of-chiplets design ...

Celestial AI™, creator of the Photonic Fabric™ optical interconnect technology platform, today announced the appointment of Lip-Bu Tan to the Board of Directors.